Telink Semi develops Bluetooth low-energy system-on-chip (SoC) platforms targeting embedded wireless applications, with its vulnerability footprint centered on products such as the TLSR8232, TLSR8251, and TLSR8253 families and their associated SDKs. The observed disclosures reflect the complexity of wireless protocol implementation and embedded firmware, though the vendor's overall exposure remains modest in scope; current severity, exploitation, and advisory details are shown alongside this summary.
The number and severity of CVEs published that impact products developed by Telink Semi over time
Signals from CVEs in this vendor scope (2 CVEs).
2 CVEs · Highest risk first
| CVE | Published | CVSS | Risk | KEV | Exploit |
|---|---|---|---|---|---|
CVE-2019-19194HIGH The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3 | Feb 12, 2020 | 8.8 | 25 | NO | NO |
CVE-2019-19196MEDIUM The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3 | Feb 12, 2020 | 6.5 | 20 | NO | NO |
Signals from CVEs in this vendor scope (2 CVEs).
An overview of all social media posts that mention a CVE ID that affects a product developed by Telink Semi.
Media articles that mention a CVE ID that affects a product developed by Telink Semi — matched by CVE ID, not by vendor name.