Qualcomm's vulnerability footprint spans an exceptionally broad portfolio of mobile system-on-chip processors, wireless connectivity components, and firmware that sit at the foundation of billions of smartphones, IoT devices, and embedded systems, presenting one of the largest and most pervasive attack surfaces in the landscape. Vulnerabilities affecting the vendor skew toward serious outcomes, with an elevated share reaching critical severity, reflecting the privileged execution context and memory access granted to firmware and radio-stack components. The exposure recurs across product lines such as the WCD audio codec and WSA wireless modules through memory-safety weakness classes including out-of-bounds reads and writes, buffer overflows, use-after-free conditions, and improper bounds checking—flaw types characteristic of native firmware and signal-processing code where direct hardware interaction and tight resource constraints limit defensive abstractions. The ubiquity and depth of Qualcomm's silicon in deployed devices means that high-severity flaws in these components can affect entire device populations and require coordination across multiple vendors for remediation. Defenders should treat Qualcomm silicon advisories as broadly applicable to the mobile and embedded ecosystem; current exploitation activity and exposure counts are shown alongside this summary.
The number and severity of CVEs published that impact products developed by Qualcomm, Inc. over time
Of all the CVEs published by Qualcomm, Inc. as a CNA, 80.3% affect products that Qualcomm, Inc. develops as a vendor.
Of all the CVEs published that affect products developed by Qualcomm, Inc., 97.1% are self-published by Qualcomm, Inc. as a CNA.
Signals from CVEs in this vendor scope (2509 CVEs).
2,509 CVEs · Highest risk first
| CVE | Published | CVSS | Risk | KEV | Exploit |
|---|---|---|---|---|---|
CVE-2005-4267HIGH Stack-based buffer overflow in Qualcomm WorldMail 3.0 allows remote attackers to execute arbitrary code via a long IMAP command that ends with a "}" character, as demonstrated usin | Dec 21, 2005 | 7.5 | 74 | NO | YES |
CVE-2026-21385HIGH Memory corruption while using alignments for memory allocation. | Mar 2, 2026 | 7.8 | 73 | YES | NO |
CVE-2025-21479HIGH Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands. | Jun 3, 2025 | 8.6 | 69 | YES | NO |
CVE-2025-21480HIGH Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands. | Jun 3, 2025 | 8.6 | 67 | YES | NO |
CVE-2021-1905HIGH Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon | May 7, 2021 | 7.8 | 67 | YES | NO |
CVE-2024-43047HIGH Memory corruption while maintaining memory maps of HLOS memory. | Oct 7, 2024 | 7.8 | 65 | YES | NO |
CVE-2025-27038HIGH Memory corruption while rendering graphics using Adreno GPU drivers in Chrome. | Jun 3, 2025 | 7.5 | 64 | YES | NO |
CVE-2023-33063HIGH Memory corruption in DSP Services during a remote call from HLOS to DSP. | Dec 5, 2023 | 7.8 | 64 | YES | NO |
CVE-2023-33107HIGH Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | Dec 5, 2023 | 7.8 | 63 | YES | NO |
CVE-2013-2596HIGH Integer overflow in the fb_mmap function in drivers/video/fbmem.c in the Linux kernel before 3.8.9, as used in a certain Motorola build of Android 4.1.2 and other products, allows | Apr 13, 2013 | 7.8 | 63 | YES | NO |
Signals from CVEs in this vendor scope (2509 CVEs).
An overview of all social media posts that mention a CVE ID that affects a product developed by Qualcomm, Inc..
Media articles that mention a CVE ID that affects a product developed by Qualcomm, Inc. — matched by CVE ID, not by vendor name.