CVE-2018-5868 describes a buffer overflow vulnerability in WideVine components within various Qualcomm Snapdragon automobile and mobile platforms. This flaw, stemming from insufficient input size validation, allows a local attacker with low privileges to achieve high impact on confidentiality, integrity, and availability. Rated with a CVSS score of 7.8 (High), this vulnerability is not known to be actively exploited, lacks public exploit code, and has garnered minimal community or media attention.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.0
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.