CVE-2018-5867 describes a buffer overflow vulnerability in WideVine, affecting numerous Qualcomm Snapdragon mobile, automobile, and wear platforms due to insufficient input size checking. This high-severity vulnerability (CVSS 7.8) can lead to significant impacts on confidentiality, integrity, and availability, requiring local access and low privileges to exploit. Despite its severity, there is no evidence of active exploitation, publicly available exploit code, or significant community discussion, and it is not listed in CISA's KEV catalog.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.0
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.