CVE-2018-11862 describes a buffer overflow vulnerability within the WLAN module of Qualcomm Snapdragon Mobile platforms, specifically affecting versions SD 845, SD 850, and SDA660. This flaw stems from insufficient input length validation. With a CVSS score of 7.8 (HIGH), this vulnerability can be exploited locally with low complexity, potentially leading to high impact on confidentiality, integrity, and availability. There is currently no evidence of active exploitation, nor are there publicly available exploit modules or significant community discussion surrounding this CVE.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.0
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.