CVE-2017-18323 describes a cryptographic key material leak within TDSCDMA RRC debug messages across numerous Qualcomm Snapdragon automobile, mobile, and wear platforms. This vulnerability has a CVSS score of 5.5 (Medium), indicating that a local attacker with low privileges could exploit it with low complexity to achieve high confidentiality impact, without affecting integrity or availability. There is no evidence of active exploitation, public exploit code (Metasploit, Nuclei, ExploitDB), or significant community discussion or media coverage surrounding this CVE.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.0
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N
The average CVE in this peer group has 0.0 Twitter, 0.0 Reddit, 0.0 Bluesky, 0.0 Mastodon, and 0.1 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.1 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.