CVE-2017-18173 describes an integer underflow vulnerability affecting various Qualcomm Snapdragon Mobile platforms, including SD 425, SD 625, and SD 835. This flaw occurs when processing Android verified boot signatures of excessive length. With a CVSS score of 7.8 (High), the vulnerability allows for high impact to confidentiality, integrity, and availability through a local attack with low complexity. Currently, there is no evidence of active exploitation, nor are there publicly available exploit modules or significant community discussion surrounding this CVE.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.0
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.