CVE-2016-2063 describes a stack-based buffer overflow vulnerability in the MSM Thermal driver (supply_lm_input_write function) of the Linux kernel 3.x, specifically impacting Qualcomm Innovation Center (QuIC) Android contributions for MSM devices. An attacker could exploit this by sending a large amount of data via the debugfs interface, potentially leading to a denial of service or other unspecified impacts. With a CVSS v3.1 score of 7.8 (High), this vulnerability has a local attack vector, low attack complexity, and high impact on confidentiality, integrity, and availability. There is no evidence of active exploitation, public exploit code (Metasploit, Nuclei, ExploitDB), or significant community discussion or media coverage surrounding this CVE.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
>= 3.0, <= 3.19.8CPE matchmatch criteria | cpe:2.3:o:linux:linux_kernel:*:*:*:*:*:*:*:* |
CVSS version used by this source: 3.1
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.