CVE-2023-33023 is a memory corruption vulnerability affecting Qualcomm products, specifically occurring when processing a "finish_sign" command with a rsp buffer. Rated 7.8 HIGH on CVSS, this flaw allows a local, low-privileged attacker to achieve high confidentiality, integrity, and availability impacts with low attack complexity. Currently, there is no public exploit code available, nor is there evidence of active exploitation, and it has garnered minimal community discussion or media coverage.
| Vendor | Product | Version(s) | CPE |
|---|---|---|---|
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:315_5g_iot_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:apq8037_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:apq8064au_firmware:-:*:*:*:*:*:*:* | ||
Range not provided by sourceCPE matchmatch criteria | cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:* |
CVSS version used by this source: 3.1
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
The average CVE in this peer group has 0.0 Twitter, 0.1 Reddit, 0.2 Bluesky, 0.1 Mastodon, and 0.2 GitHub mentions.
No media coverage found for this CVE.
The average CVE in this peer group has 0.3 InfoSec Media, 0.0 Vendor Blog, and 0.0 Security Researcher mentions.
Remediation records are not available for this CVE.